Hybrid thermal interface material for ic packages with integrated heat spreader

ABSTRACT

Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first thermal resistance. A second TIM is applied to the die and/or the substrate, and has a second thermal resistance that is greater than the first thermal resistance. An open end of a heat spreader lid is mounted to the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate. The first TIM and the second TIM are each in contact with an inner surface of the heat spreader lid. A ring-shaped stiffener may surround the die and be connected between the substrate and heat spreader lid by the second TIM.

BACKGROUND

1. Field of the Invention

The present invention relates to integrated circuit packagingtechnology.

2. Background Art

Integrated circuit (IC) chips or dies from semiconductor wafers aretypically interfaced with other circuits using a package that can beattached to a printed circuit board (PCB). One such type of IC packageis a ball grid array (BGA) package. BGA packages provide for smallerfootprints than many other package solutions available today. A BGApackage includes a die attached to substrate of the package, and anarray of solder ball pads located on a bottom external surface of thepackage substrate. Solder balls are attached to the solder ball pads.The solder balls are reflowed to attach the package to the PCB.

In some BGA packages, signals of the die are interfaced with electricalfeatures (e.g., bond fingers) of the substrate using wire bonds. In sucha BGA package, wire bonds are connected between signal pads/terminals ofthe die and electrical features of the substrate. In another type of BGApackage, which may be referred to as a “flip chip package,” a die may beattached to the substrate of the package in a “flip chip” orientation.In such a BGA package, solder bumps are formed on the signalpads/terminals of the die, and the die is inverted (“flipped”) andattached to the substrate by reflowing the solder bumps so that theyattach to corresponding pads on the surface of the substrate.

Typically IC packages are asymmetrical (in the direction perpendicularto the plane of the substrate), and are mechanically unbalanced. Thisasymmetry, along with the different materials used in the packaging(e.g., an organic package substrate, which has a different coefficientof thermal expansion (CTE) than the IC die), cause both mechanical andthermal stresses, which in turn lead to package warpage and co-planarityissues. Package warp can place stress on the solder joints of the die,leading to detachment of some of the solder bumps and/or physical damageto the die. Thus, flip chip packages are frequently configured todisperse the generated heat, such as though the inclusion of heat sinks.For instance, a heat spreader in the form of a cap may be mounted to apackage over the die to aid in dispersing excess heat and to reducingpackage warping. The die may be interfaced with the heat spreader by anadhesive that conducts heat from the die to the heat spreader. However,properties of the adhesive material determine whether the adhesive ismore effective at transferring heat from the die to the heat spreader,or is more effective at adhering to the heat spreader in a manner thatenhances package strength and thereby reduces package warping. Currentadhesive materials tend to be effective at heat transfer or at warpprevention, but are not highly effective at both.

BRIEF SUMMARY

Methods, systems, and apparatuses are described for flip chip packagesthat include two or more different thermal interface materials used totransfer heat from dies to heat spreaders and to enhance packagemechanical strength/rigidity, substantially as shown in and/or describedherein in connection with at least one of the figures, as set forth morecompletely in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

The accompanying drawings, which are incorporated herein and form a partof the specification, illustrate embodiments and, together with thedescription, further serve to explain the principles of the embodimentsand to enable a person skilled in the pertinent art to make and use theembodiments.

FIG. 1 shows a cross-sectional side view of an example flip chippackage.

FIG. 2 shows a cross-sectional side view of the flip chip package ofFIG. 1 undergoing package warp due to heat generated during operation.

FIG. 3 shows a cross-sectional side view of a flip chip package thatincludes a heat spreader lid attached by first and second thermalinterface materials (TIMs), according to an example embodiment.

FIG. 4 shows a flowchart of a process for forming a flip chip packagethat includes a heat spreader lid attached by first and second TIMs,according to an example embodiment.

FIGS. 5-8 show top views of flip chip packages that have two or moreTIMs formed on a die in corresponding example patterns (with heatspreader lids not visible), according to example embodiments.

FIG. 9 shows a process that may be performed during the flowchart ofFIG. 4 to form a flip chip package that includes a first TIM thatadheres a flip chip die to a heat spreader lid, and a second TIM thatadheres a package substrate to the heat spreader lid, according to anexample embodiment.

FIG. 10 shows a cross-sectional side view of a flip chip package thatincludes a first TIM that adheres a flip chip die to a heat spreaderlid, and a second TIM that adheres a package substrate to the heatspreader lid, according to an example embodiment.

FIG. 11 shows a top view of a flip chip package that has a first TIM ona flip chip die surface, and a second TIM on a package substrate surface(with a heat spreader lid of the flip chip package not visible),according to an example embodiment.

FIG. 12 shows a flowchart that may be performed in the flowchart of FIG.4 to form a flip chip package that includes a first TIM that adheres aflip chip die to a heat spreader lid, and a second TIM that mounts astiffener ring between a package substrate and the heat spreader lid,according to an example embodiment.

FIG. 13 shows a cross-sectional side view of a flip chip package thatincludes a first TIM that adheres a flip chip die to a heat spreaderlid, and a second TIM that mounts a stiffener ring between a packagesubstrate and the heat spreader lid, according to an example embodiment.

FIG. 14 shows a top view of a flip chip package that has a first TIM ona flip chip die surface, and a second TIM on a stiffener ring mounted toa package substrate surface (with a heat spreader lid of the flip chippackage not visible), according to an example embodiment.

Embodiments will now be described with reference to the accompanyingdrawings. In the drawings, like reference numbers indicate identical orfunctionally similar elements. Additionally, the left-most digit(s) of areference number identifies the drawing in which the reference numberfirst appears.

DETAILED DESCRIPTION Introduction

The present specification discloses numerous example embodiments. Thescope of the present patent application is not limited to the disclosedembodiments, but also encompasses combinations of the disclosedembodiments, as well as modifications to the disclosed embodiments.

References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedmay include a particular feature, structure, or characteristic, butevery embodiment may not necessarily include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to effect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

Furthermore, it should be understood that spatial descriptions (e.g.,“above,” “below,” “up,” “left,” “right,” “down,” “top,” “bottom,”“vertical,” “horizontal,” etc.) used herein are for purposes ofillustration only, and that practical implementations of the structuresdescribed herein can be spatially arranged in any orientation or manner.

Example Embodiments

A “flip chip package” is a type of ball grid array (BGA) package thatpackages one or more integrated circuit dies. In a flip chip package,solder bumps are formed on the signal pads/terminals of a die, and thedie is inverted (“flipped”) and attached to the substrate of the packageby reflowing the solder bumps so that they attach to corresponding padson the surface of the substrate. This inverted orientation of the die onthe substrate is referred to as a “flip chip” orientation.

FIG. 1 shows a cross-sectional side view of an example flip chip package100. As shown in FIG. 1, flip chip package 100 includes a heat spreaderlid 102, an integrated circuit die/chip 104, an adhesive 106, asubstrate 108, a plurality of solder bumps/balls 110, and an adhesive112. As shown in FIG. 1, die 104 is mounted to substrate 108 by solderbumps/balls 110. Heat spreader lid 102 is mounted to substrate 108 overdie 104. Adhesive 112 attaches a rim of a heat spreader lid 102 tosubstrate 108. Adhesive 106 is present on a top surface of die 104 tointerface die 104 with an inner surface of heat spreader lid 102.

Typically IC packages are asymmetrical (in the direction perpendicularto the plane of the substrate), and are mechanically unbalanced. Thisasymmetry, along with the different materials used in the packaging(e.g., an organic package substrate, which has a different coefficientof thermal expansion (CTE) than the IC die), cause both mechanical andthermal stresses, which in turn lead to package warpage and co-planarityissues.

For instance, FIG. 2 shows a cross-sectional side view of flip chippackage 100 of FIG. 1 warping due to heat generated by die 104 duringoperation. As shown in FIG. 1, both substrate 108 and heat spreader lid102 are warped (e.g., curving concave downward in FIG. 1) due to thermalexpansion from heat output by die 104. Such package warp can placestress on the solder joints of die 104, such as at solder bumps 110,leading to detachment of some of solder bumps 110 and/or physical damageto the die. Furthermore, such package warp can cause detachment (e.g.,delamination) of die 104 from heat spreader lid 102 by adhesive 106,enabling further warping of flip chip package 100.

Heat spreader lid 102 may be present in package 100 to aid in dispersingexcess heat from die 104 and therefore to reducing warping of package100. Die 104 is interfaced with heat spreader lid 102 by adhesive 106,which may be selected to have low thermal resistance (e.g., lowresistance to heat transfer) to efficiently conduct heat from die 104.However, due to the limitations of current adhesive materials, ifadhesive 106 has low thermal resistance, adhesive 106 will converselytend to have a low “modulus.” “Modulus” indicates a stiffness propertyof an adhesive. A high modulus means that the adhesive material isrelatively stiff (is relatively hard when the adhesive material cures)and is a stronger adhesive, and a low modulus means that the adhesivematerial is less stiff (e.g., is more pliable when the adhesive materialcures) and is a weaker adhesive. Adhesives with lower thermal resistance(relatively high heat conductance) tend to have a lower modulus (arerelatively less stiff/more pliable), and adhesives with higher thermalresistance (relatively lower heat conductance) tend to have a highmodulus (relatively more stiffness pliable). If adhesive 106 hasrelatively low thermal resistance, and therefore a low modulus, adhesive106 may not strongly adhere die 104 to heat spreader lid 102. This leadsto greater flexing of heat spreader lid 102, and therefore to greaterpackage warping. Current adhesive materials typically are effective atheat transfer or warp prevention, but are not highly effective at both.

Embodiments, overcome these current problems with adhesives. Inembodiments, two or more thermal interface materials/adhesives are usedin an integrated circuit package to enable both efficient heat transferand reduced package warp. Although embodiments are frequently describedherein with respect to flip chip packages, in embodiments, two or morethermal interface materials/adhesives may be used in other types ofintegrated circuit packages, such as other types of BGA packages, pingrid array (PGA) packages, quad flat pack (QFP) packages, and furthertypes of integrated circuit packages, to enable efficient heat transferand reduced package warp.

Embodiments may be configured in various ways. For instance, FIG. 3shows a side cross-sectional view of a flip chip package 300, accordingto an example embodiment. Flip chip package 300 may be a plastic BGA(PBGA) package, a flex BGA package, a ceramic BGA package, or other typeof flip chip BGA package. Flip chip package 300 includes a heat spreaderlid 302, an integrated circuit die/chip 304, a substrate 308, anadhesive 314, a plurality of solder bumps/balls 316, an underfillmaterial 318, a plurality of solder balls 320, a first thermal interfacematerial (TIM) 322, and a second TIM 324. Package 300 is described asfollows.

Substrate 308 has a first (e.g., top) surface 310 that is opposed to asecond (e.g., bottom) surface 312 of substrate 308. Substrate 308 mayinclude one or more electrically conductive layers (such as at firstsurface 310) that are separated by one or more electrically insulatinglayers. An electrically conductive layer may include traces/routing,bond fingers, contact pads, and/or other electrically conductivefeatures. For example, BGA substrates having one electrically conductivelayer, two electrically conductive layers, or four electricallyconductive layers are common. The electrically conductive layers may bemade from an electrically conductive material, such as a metal orcombination of metals/alloy, including copper, aluminum, tin, nickel,gold, silver, etc. In embodiments, substrate 308 may be rigid or may beflexible (e.g., a “flex” substrate). The electrically insulatinglayer(s) may be made from ceramic, plastic, tape, and/or other suitablematerials. For example, the electrically insulating layer(s) ofsubstrate 308 may be made from an organic material such as BT(bismaleimide triazine) laminate/resin, a flexible tape material such aspolyimide, a flame retardant fiberglass composite substrate boardmaterial (e.g., FR-4), etc. The electrically conductive andnon-conductive layers can be stacked and laminated together, orotherwise attached to each other, to form substrate 308, in a manner aswould be known to persons skilled in the relevant art(s).

As shown in FIG. 3, die 304 has opposing first and second surfaces 326and 328 (e.g., bottom and top surfaces in FIG. 3). Die 304 is attachedto substrate 308 in a “flip chip” manner. Solder bumps 316 or any otherelectrically conductive feature (e.g., solder balls, etc.) are formed onthe signal pads/terminals of die 304 and/or on corresponding pads onsurface 310 of substrate 308. Die 304 is attached to substrate 308 in aninverted (“flipped”) orientation with respect to the attachment of diesin wire bond BGA package configurations. In such an orientation, theactive surface of die 304 faces substrate 308. Die 304 is attached tosubstrate 308 by reflowing solder bumps 316 so that solder bumps 316attach to corresponding pads on surface 310 of substrate 308. Althoughnot visible in FIG. 3, surface 310 of substrate 308 has a mountingregion for a flip chip die. The mounting region includes an array ofsolder ball/bump pads corresponding to solder bumps 316. Any number ofpads may be present in the mounting region, depending on the number ofsolder bumps 316 on the flip chip die to be mounted thereto. When die304 is mounted to the mounting region, solder bumps 316 attach to padsof the array on substrate 308.

Underfill material 318 may be optionally present, as shown in FIG. 3.Underfill material 318 fills in a space between die 304 and substrate308 between solder bumps 316. Underfill material 318 may be an epoxy orany other suitable type of underfill material, as would be known topersons skilled in the relevant art(s).

A plurality of solder balls 320 is attached to second surface 312 ofsubstrate 308 (e.g., by a ball mounting process). Solder balls 320attach to an array of solder ball pads (not visible in FIG. 3) on secondsurface 312 of substrate 308. Any number of solder ball pads may bepresent on second surface 312 for receiving solder balls 320, and thearray may be arranged in any number of rows and columns. Note that thearray of solder ball pads may be lacking some pads so that a full arrayof solder balls 320 on second surface 312 is not necessarily present.The solder ball pads are electrically coupled through substrate 308(e.g., by electrically conductive vias and/or routing) to theelectrically conductive features (e.g., traces, bond fingers, contactregions, etc.) of first surface 310 of substrate 308 to enable signalsof die 304 to be electrically connected to solder balls 320 throughsubstrate 308.

An open end of heat spreader lid 302 is mounted to first surface 310 ofsubstrate 308 over die 304 so that die 304 is positioned in an enclosureformed by heat spreader lid 302 and substrate 308. Heat spreader lid 302encloses die 304 from the top side and lateral sides (surfaces that areperpendicular to surface 310 of substrate 308), while substrate 308covers the open end of heat spreader lid 302 below die 304 in FIG. 3.For instance, heat spreader lid 302 may have the shape of a frame orring (e.g., a rectangular ring, a circular ring, or other ring shape)that has an open end that is opposed to a solid/closed end (acovered/lid end). As such, in an embodiment, heat spreader lid 302 mayhave the shape of a relatively flat box that has one opened end. Die 304is positioned on substrate 308 within a recess or cavity in heatspreader lid 302 that is accessible at the open end of heat spreader lid302.

Heat spreader lid 302 may be present to provide environmental protectionfor die 304, EMI shielding for die 304, as well as warp reduction forpackage 300. Heat spreader lid 302 may be made from a metal, such asstainless steel (e.g., 0.007 inch thick) and/or other material.

As shown in FIG. 3, first and second TIMs 322 and 324 are both incontact with surface 328 of die 304 and with an inner surface 330 ofheat spreader lid 302. Inner surface 330 is a central surface within thecavity formed by heat spreader lid 302 (facing downward in FIG. 3).First and second TIMs 322 and 324 are adhesives that adhere die 304 toheat spreader lid 302, and transfer heat from die 304 to heat spreaderlid 302 during operation of die 304. First TIM 322 is arranged onsurface 328 of die 304 in a first pattern, and second TIM 324 isarranged on surface 328 of die 304 in a second pattern. First and secondTIMs 322 and 324 are co-planar and are not vertically overlapping.

Furthermore, first TIM 322 has a first thermal resistance, and secondTIM 324 has a second thermal resistance that is greater than the firstthermal resistance of first TIM 322. As such, first TIM 322 conductsheat from die 304 to heat spreader lid 302 more efficiently than secondTIM 324, and can achieve a lower junction temperature at the interfaceof die 304 with heat spreader lid 302. Still further, second TIM 324 hasa first modulus (e.g., mechanical stiffness or rigidity) that is greaterthan a second modules of the second TIM 322. As such, first TIM 322 maybe present between die 304 and heat spreader lid 302 to provideefficient thermal transfer between die 304 and heat spreader lid 302,and second TIM 324 may be present between die 304 and heat spreader lid302 to provide better adhesion between die 304 and heat spreader lid 302and therefore reduced package warping. The presence of both first andsecond TIMs 322 and 324 in package 300 enables relatively high thermaltransfer and relatively high package stiffness, as compared toconventional packages that include a single adhesive that provideseither high heat transfer or high warp reduction, but not both.

First and second TIMs 322 and 324 can each be formed of a material suchas an epoxy, an adhesive gel, a glue, a solder, or another type ofthermal interface material. In one embodiment, first TIM 322 may be anadhesive gel. An adhesive gel may be configured for relatively lowerthermal resistance (e.g., may include thermally conductive particles,such as metal particles (e.g., silver particles, gold particles, etc.))compared to some other materials, such as epoxies, for greater heattransfer. When used as a TIM, an adhesive gel may be applied and curedto form cross-linked polymers, becoming less viscous and providingadhesive properties of the adhesive gel.

In an embodiment, second TIM 322 may be an epoxy (e.g., a thermosettingpolymer), which can be more rigid and adhesive than some other materials(e.g., adhesive gels), providing greater stiffness to a package, andless chance of delamination of the die from the heat spreader lid. Whenused as a TIM, an epoxy may be applied and cured to polymerize theepoxy, becoming harder and providing adhesive properties of the adhesivegel.

For instance, in one example, first TIM 322 may be X23-7772-4 gel fromShin-Etsu, which has relatively lower thermal resistance (0.25° Ccm²/W),but relatively lower modulus (0.0004 GPa). Furthermore, second TIM 322may be SE4450 epoxy from Dow-Corning, which has relatively highermodulus (0.005 GPa), but relatively higher thermal resistance (0.5°Ccm²/W). SE4450 epoxy has a thermal resistance that is 2 times largerthan the thermal resistance of X23-7772-4, but provides less packagewarp. By using these types of TIMs together in a same flip chip package,greater thermal transfer may be achieved, while also achieving greaterpackage stiffness.

A package that contains two or more TIMs may be fabricated in variousways. For instance, FIG. 4 shows a flowchart 400 of a process forforming a flip chip package that includes a heat spreader lid attachedby first and second TIMs, according to an example embodiment. Flip chippackage 300 may be assembled according to flowchart 400, for example.Note that the steps of flowchart 400 do not necessarily need to beperformed in the order shown. Flowchart 400 is described as follows withreference to flip chip package 300 of FIG. 3, for purposes ofillustration.

Flowchart 400 begins with step 402. In step 402, an integrated circuitdie is mounted to a surface of a substrate. For example, as shown inFIG. 3, die 304 may be mounted to surface 310 of substrate 308. Die 304may be applied to surface 310 in any manner, such as by a pick-and-placemachine or other mechanism. Solder may be applied to terminals onsurface 326 of die 304 and/or on pads on surface 310 of substrate 308,die 304 may be aligned with the pads on surface 310, and the solder maybe reflowed to form solder bumps 316 and attach die 304 to substrate308. Underfill material 318 may be applied in any manner to encapsulatesolder bumps 316 under die 304, including according to proprietary orconventional techniques (e.g., being applied and cured, etc.).

In step 404, a first thermal interface material (TIM) is applied on asurface of the die in a first pattern. For instance, as shown in FIG. 3,first TIM 322 may be applied to surface 328 of die 304. First TIM 322may be applied in any manner, including by a conventional or proprietaryadhesive dispenser. As further described below, first TIM 322 may beapplied in any pattern on surface 328 of die 304. Note that in analternative embodiment, first TIM 322 may be alternatively oradditionally applied on inner surface 330 of heat spreader lid 302.

In step 406, the second TIM is applied on the second surface of the diein a second pattern. For instance, as shown in FIG. 3, second TIM 324may be applied to surface 328 of die 304. Second TIM 324 may be appliedin any manner, including by a conventional or proprietary adhesivedispenser. As further described below, second TIM 324 may be applied inany pattern on surface 328 of die 304. Note that in an alternativeembodiment, second TIM 324 may be alternatively or additionally appliedon inner surface 330 of heat spreader lid 302.

As described above, first and second TIMs 324 may be applied in anysuitable patterns. Such patterns may be complimentary or interlocking,such that the entirety of surface 328 of die 304 is covered, or suchthat one or more portions of surface 328 of die 304 are not covered.Furthermore, one or one additional patterns of one or more further TIMsmay be applied on surface 328. Example TIM patterns include rectangularpatterns, circular patterns, oval patterns, elliptical patterns,triangular patterns, strip patterns, ring shaped patterns, irregularlyshaped patterns, other polygonal patterns, etc. The example TIM patternsdescribed herein (or otherwise known) may be combined or used togetherin any combination.

For instance, FIGS. 5-8 show top views of flip chip packages thatinclude two or more TIMs in corresponding example patterns, and withheat spreader lids not visible, according to example embodiments. FIG. 5shows a top view of a flip chip package 500. As shown in FIG. 5, surface310 of substrate 308 is visible. Adhesive 314 is shown in a rectangularring-shaped pattern along the perimeter edges of surface 310. Adhesive314 is configured to attach a rim of a heat spreader lid, such as heatspreader lid 302 of FIG. 3, to substrate 308. A heat spreader lid is notvisible in FIGS. 5-8. First TIM 322 covers a first portion of the diesurface (e.g., surface 328 of die 302, which is not visible in FIG. 3)in a first pattern, and second TIM 324 covers a second portion of thedie surface in a second pattern. In the example of FIG. 5, the firstpattern of first TIM 322 is a centrally located rectangular pattern(e.g., located over a center of the surface of the die). and the secondpattern of second TIM 324 is a perimeter rectangular ring-shaped patternthat surrounds the first pattern of first TIM 322 (e.g., along the fourperimeter edges of the die surface). First and second TIMs 322 and 324adhere an inner central region of a heat spreader lid (e.g., innersurface 330 of heat spreader lid 302 of FIG. 3) to the die surface.

In the embodiment of FIG. 5, greater thermal transfer from the center ofthe die to the heat spreader lid is enabled by first TIM 322, which hasa lower thermal resistance than second TIM 324. This may be useful,because a die typically generates more heat at or near its center(location of more active circuitry) relative to perimeter regions of thedie surface. Furthermore, greater adhesion to the heat spreader lid andgreater stiffness is provided at the perimeter edges of the die bysecond TIM 324, which has a greater modulus than first TIM 322. This maybe useful to provide greater stiffness and reduced warping for package300 by providing a more rigid material along the edges and at eachcorner of the die surface.

FIG. 6 shows a top view of a flip chip package 600. As shown in FIG. 6,surface 310 of substrate 308 is visible. Adhesive 314 is shown in arectangular ring-shaped pattern along the perimeter edges of surface 310(to attach a heat spreader lid). First TIM 322 covers a first portion ofthe die surface in a first pattern, and second TIM 324 covers a secondportion of the die surface in a second pattern. In the example of FIG.6, the first pattern of first TIM 322 is a first rectangular shapedpattern that extends across a central region of die surface, fromedge-to-opposite edge of the die surface, and the second pattern ofsecond TIM 324 includes second and third rectangular shaped patterns.The second and third rectangular shaped patterns extend along opposingedges of the die surface (from corner-to-corner). The first rectangularshaped pattern of TIM 322 is between the second and third rectangularshaped patterns of the TIM 324. First and second TIMs 322 and 324 boththe die surface to an inner central region of a heat spreader lid.

In the embodiment of FIG. 6, greater thermal transfer edge-to-edgeacross the center of the die to the heat spreader lid is enabled byfirst TIM 322, which has a lower thermal resistance than second TIM 324.Furthermore, greater adhesion to the heat spreader lid and greaterstiffness is provided by TIM 324 along the two opposing perimeter edgesof the die covered by TIM 324 and at each corner of the die surface,because TIM 324 has a greater modulus than first TIM 322.

In another embodiment, a higher modulus TIM may be patterned at one ormore corners of a die surface. For instance, FIG. 7 shows a top view ofa flip chip package 700. As shown in FIG. 7, surface 310 of substrate308 is visible. Adhesive 314 is shown in a rectangular ring-shapedpattern along the perimeter edges of surface 310 (to attach a heatspreader lid). First TIM 322 covers a first portion of the die surfacein a first pattern, which is a cross-shaped pattern on a central regionof the die surface that extends to each edge of the die surface, andsecond TIM 324 covers a second portion of the die surface in a secondpattern, which includes a rectangular shape at each corner of the diesurface. First and second TIMs 322 and 324 adhere the die surface to aninner central region of a heat spreader lid.

In the embodiment of FIG. 7, greater thermal transfer from the center ofthe die to the heat spreader lid is enabled by first TIM 322, which hasa lower thermal resistance than second TIM 324. Furthermore, greateradhesion to the heat spreader lid and greater stiffness is provided ateach corner of the die surface by second TIM 324, which has a greatermodulus than first TIM 322.

FIG. 8 shows a top view of a flip chip package 800. As shown in FIG. 8,surface 310 of substrate 308 is visible. Adhesive 314 is shown in arectangular ring-shaped pattern along the perimeter edges of surface 310(to attach a heat spreader lid). First TIM 322 covers a first portion ofthe die surface in a first pattern, which is a centrally locatedrectangular region on the die surface, and second TIM 324 covers aperimeter rectangular ring-shaped pattern that surrounds the firstpattern of first TIM 322 (e.g., along the four perimeter edges of thedie surface). Furthermore, a circular shaped third TIM 802, an ovalshaped fourth TIM 804, and a rectangular shaped fifth TIM 806 are eachpresent within the rectangular pattern of first TIM 322. First-fifthTIMs 322, 324, 802, 804, and 806 adhere the die surface to an innercentral region of a heat spreader lid.

In the embodiment of FIG. 8, greater thermal transfer from the center ofthe die to the heat spreader lid is enabled by first TIM 322, which hasa lower thermal resistance than second TIM 324. Furthermore, third-fifthTIMs 802, 804, and 806 may be located over corresponding hot spots ofthe die. For instance, in an embodiment, a heat map may be generated forthe die (e.g., by measuring heat during operation, by identifyinghigh-power functional blocks of the die, etc.), and one or more hotspots on the die surface may be identified based on the heat map. TIMswith relatively low thermal resistance may be selected to be applied tothe die surface at the identified hot spots. For instance, the positionsof third-fifth TIMs 802, 804, and 806 on the die surface may correspondto three determined hot spots.

Still further, greater adhesion to the heat spreader lid and greaterstiffness is provided around the perimeter of the die surface by secondTIM 324, which has a greater modulus than first TIM 322.

For instance, in an embodiment provided for purposes of illustration,first TIM 322 may be an adhesive gel, second TIM 324 may be an epoxy,and third-fifth TIMS 802, 804, and 806 may be solder. Solder has veryhigh thermal transfer (low thermal resistance) (e.g., higher thanadhesive gels and epoxies) and very high modulus (very stiff) (higherthan adhesive gels and epoxies). However, because solder is very stiffwhen solidified and has a high coefficient of thermal expansion (CTE),if solder is applied to a large area of surface 328 of die 304, thesolder can cause a large amount of stress and damage to die when heatedduring operation of die 304. As such, in an embodiment, a small amountof solder may be applied directly to hotspots of die 304, such as at thelocations of third-fifth TIMS 802, 804, and 806, to provide very highthermal transfer at the hotspots. First TIM 322 may be applied as shownin FIG. 8 to provide generally high thermal transfer around the rest ofthe central region of surface 328 of die 304 (without being overly stiffand causing damage to die 304). Second TIM 324 may be applied around theperimeter of surface 328 of die 304 to provide sufficient rigidity andadhesiveness to heat spreader lid 302 to reduce package warping.

Referring back to FIG. 4, in step 408, an open end of a heat spreaderlid is mounted to the surface of the substrate such that the die ispositioned in an enclosure formed by the heat spreader lid andsubstrate, the first TIM and the second TIM each being in contact withan inner surface of the heat spreader lid. For example, as shown in FIG.3, the open end of heat spreader lid 302 (the lower end in FIG. 3) maybe mounted to surface 310 of substrate 308 by adhesive 314. Adhesive 314may be applied to surface 310 in a ring, and/or may be applied to a rimof heat spreader lid 302 around the open end, and the rim of heatspreader lid 302 may be mounted to surface 310. Adhesive 314 may becured, if applicable. Any suitable adhesive material may be used foradhesive 314, including an epoxy, an adhesive gel, a glue, a solder,etc., including a TIM described elsewhere herein. As shown in FIG. 3,die 304 is positioned in an enclosure formed by heat spreader lid 302and substrate 308. Furthermore, first and second TIMs 322 and 324 areeach in contact with inner surface 330 of heat spreader lid 302. In thismanner, first and second TIMs 322 and 324 provide for transfer of heatfrom die 304 to heat spreader lid 302. Furthermore, first and secondTIMs 322 and 324 adhere heat spreader lid 302 to die 304 in a mannerthat reduces warping of package 300.

In step 410, a plurality of interconnect members is attached to a secondsurface of the substrate. In an embodiment, solder balls 320 areattached to solder ball pads on surface 312 of substrate 308 inconventional or proprietary manner. Solder balls 320 may be reflowed toattach package 300 to a printed circuit board (PCB). In alternativeembodiments, other types of interconnect members may be used in place ofsolder balls 320, such as pins, posts, etc.

As such, in embodiments, one or more TIMs may be used to attach a diesurface to a heat spreader lid. One or more of the TIMs may be selectedfor greater thermal transfer, while one or more others of the TIMs maybe selected for higher modulus to increase package stiffness.

In another embodiment, a first TIM may be applied to interface a surfaceof the die with the surface of the heat spreader lid, and a second TIMmay be applied to interface a surface of the package substrate directlywith the surface of the heat spreader lid. In this manner, the first TIMmay be selected to have lower thermal resistance than the second TIM toprovide high heat transfer from the die to the heat spreader lid.Furthermore, the second TIM, which connects the substrate directly tothe heat spreader lid, may be selected to have higher modulus than thefirst TIM to provide greater structural/mechanical stability for thepackage, reducing package warp.

For instance, FIG. 9 shows a step 902 that may be performed in place ofstep 406 of flowchart 400 (FIG. 4), according to an example embodiment.In step 902, the second TIM is applied to the first surface of thesubstrate to be separated from the die by a gap, the second TIM beingconnected between the first surface of the substrate and the innersurface of the heat spreader lid. Thus, step 902 enables a flip chippackage to be formed that includes a first TIM that adheres a flip chipdie to a heat spreader lid, and a second TIM that adheres a packagesubstrate to the heat spreader lid.

FIG. 10 shows a cross-sectional side view of a flip chip package 1000,according to an example embodiment. Package 1000 may be assembledaccording to flowchart 400, with step 902 performed instead of step 406.As shown in FIG. 10, package 1000 is generally similar to package 300 ofFIG. 3, except that a single TIM—first TIM 322—interfaces die 304 withheat spreader lid 302, and a second TIM 1002 interfaces substrate 308with heat spreader lid 302. Note that in an alternative embodiment,multiple different TIMs may interface die 304 with heat spreader lid302. As shown in FIG. 10, first TIM 322 covers the entirety of surface328 of die 304, and is in contact with inner surface 330 of heatspreader lid 302. Second TIM 1002 is applied to surface 310 of substrate308, and is in contact with inner surface 330 of heat spreader lid 302(alternatively, second TIM 1002 may be applied to inner surface 330instead of surface 310). As such, first TIM 322 adheres die 304 to heatspreader lid 302, and second TIM 1002 adheres substrate 308 to heatspreader lid 302. First TIM 322 may be selected to have a lower thermalresistance than second TIM 1002 to provide high thermal transfer fromdie 304 to heat spreader lid 302. Second TIM 1002 may be selected tohave a higher modulus than first TIM 322 to provide greaterstiffness/rigidity and adhesion, reducing warp of package 1000.Furthermore, by partially or fully surrounding die 304 in a ring, secondTIM 1002 can reduce pressure on die 304 due to any warping of package1000.

FIG. 11 shows a top view of flip chip package 1000, according to anexample embodiment (heat spreader lid 302 is not visible in FIG. 11). Asshown in FIG. 11, second TIM 1002 may partially surround die 322 in apartial or broken rectangular ring shape. In the example of FIG. 11, therectangular ring shape of second TIM 1002 has two openings or breaks,but in other embodiments, may have fewer or greater numbers of openingsor breaks. Furthermore, in another embodiment, the rectangular ringshape of second TIM 1002 may be continuous around die 304 (no breaks oropenings). Still further, in other embodiments, second TIM 1002 may haveother shapes than rectangular, including being round, or having othershapes mentioned elsewhere herein or otherwise known.

In the examples of FIGS. 10 and 11, second TIM 1002 is not in contactwith die 304, being separated from die 304 by a gap 1004. In otherembodiments, second TIM 1002 may be in contact with one or more sides ofdie 304.

Second TIM 1002 may be applied to substrate 308 and/or to heat spreaderlid 302 prior to, or after mounting heat spreader lid 302 to substrate308 in any manner, including being applied according to conventional orproprietary techniques.

In another embodiment, a first TIM may be applied to interface a surfaceof the die with the surface of the heat spreader lid, and a second TIMmay be applied to interface a ring shaped stiffener between the surfaceof the package substrate and the surface of the heat spreader lid. Inthis manner, the first TIM may be selected to have lower thermalresistance than the second TIM to provide high heat transfer from thedie to the heat spreader lid. Furthermore, the ring shaped stiffener andsecond TIM, which may be selected to have higher modulus than the firstTIM, provide greater structural/mechanical stability for the package,reducing package warp.

For instance, FIG. 12 shows a flowchart 1200 that may be performed inplace of step 406 of flowchart 400 (FIG. 4), according to an exampleembodiment. Furthermore, FIG. 13 shows a cross-sectional side view of aflip chip package 1300, according to an example embodiment. As shown inFIG. 13, package 1300 is generally similar to package 300 of FIG. 3,except that a single TIM—first TIM 322—interfaces die 304 with heatspreader lid 302, and a second TIM 1302 mounts a ring-shaped stiffener1302 between substrate 308 and heat spreader lid 302. Note that in analternative embodiment, multiple different TIMs may interface die 304with heat spreader lid 302. Flip chip package 1300 may be assembledaccording to flowchart 400, with flowchart 1200 being performed in placeof step 406, for example. Flowchart 1200 is described as follows withreference to flip chip package 1300 of FIG. 13, for purposes ofillustration.

Flowchart 1200 begins with step 1202. In step 1202, a first surface of astiffener ring is mounted to the first surface of the substrate by thesecond TIM, the stiffener ring forming a ring around the die. Forinstance, as shown in FIG. 13, stiffener 1302 may be mounted to surface310 of substrate 308 by a second TIM 1304. Second TIM 1304 may beapplied to surface 310 in a ring around die 304, and stiffener 1302 maybe mounted to second TIM 1304 on surface 310. Second TIM 1304 may beapplied to surface 310 in any manner (e.g., as described elsewhereherein for TIMs), including being applied according to conventional orproprietary techniques. Subsequently, a first (lower) surface ofstiffener 1302 may be positioned in contact with second TIM 1304 onsurface 310 around die 304. For instance, stiffener 1302 may be mountedaccording to a pick-and-place tprocess, or in another manner, as wouldbe known to persons skilled in the relevant art(s). In this manner,stiffener 1302 is attached to substrate 308 by second TIM 1304.

In step 1204, the second TIM is applied to the second surface of thestiffener ring to connect the second surface of the stiffener ring tothe inner surface of the heat spreader lid. For instance, as shown inFIG. 13, second TIM 1304 may be applied to the second (upper) surface ofstiffener 1302. Second TIM 1304 may be applied to stiffener 1302 in anymanner (e.g., as described elsewhere herein for TIMs), including beingapplied according to conventional or proprietary techniques.Furthermore, second TIM 1304 may be applied to stiffener 1302 prior toor after step 1202. Subsequently, when heat spreader lid 302 is mountedto substrate 308, second TIM 1304 contacts inner surface 330 of heatspreader lid 302 so that second TIM 1304 adheres stiffener 1302 to heatspreader lid 302.

Thus, flowchart 1200 enables a flip chip package to be formed thatincludes a first TIM that adheres a flip chip die to a heat spreaderlid, and a second TIM that adheres a stiffener ring between the packagesubstrate and the heat spreader lid. In FIG. 13, first TIM 322 may beselected to have a lower thermal resistance than second TIM 1304 toprovide high thermal transfer from die 304 to heat spreader lid 302.Second TIM 1304 may be selected to have a higher modulus than first TIM322 so that the combination of second TIM 1304 and stiffener 1302provides greater stiffness/rigidity and adhesion, reducing warp ofpackage 1300. By partially or fully surrounding die 304 in a ring,second TIM 1304 and stiffener 1302 can reduce pressure on die 304 due toany warping of package 1300.

FIG. 14 shows a top view of flip chip package 1300, according to anexample embodiment (heat spreader lid 302 is not visible in FIG. 14). Asshown in FIG. 14, stiffener 1302 may surround die 322 in a continuousrectangular ring shape. In another embodiment, the rectangular ringshape of stiffener 1302 may have one or more breaks or openings. Stillfurther, in other embodiments, stiffener 1302 may have other shapes thanrectangular, including being round, or having other shapes mentionedherein or otherwise known.

In the examples of FIGS. 13 and 14, stiffener 1302 is not in contactwith die 304, being separated from die 304 by a gap 1306. In otherembodiments, stiffener 1302 may be sized to be in contact with one ormore sides of die 304.

Stiffener 1302 may be made of one or more materials that areelectrically conductive, or non-electrically conductive, including apolymer, a ceramic material, or a metal or combination of metals/alloy,including copper, aluminum, tin, nickel, gold, silver, iron, steel, etc.

Note that the embodiments described herein may be combined in anymanner. Furthermore, embodiments are applicable to flip chip packagesthat include more than one IC die. Still further, embodiments may beapplicable to dies mounted in non-flip chip orientations where anon-active surface of a die is mounted on a stiffener, heat spreader, orheat sink.

Embodiments enable desired thermal performance with low package warpage.Embodiments may be used in any size of IC package, including small,medium, and large sized pages. Embodiments reduce or eliminate a need touse thick core substrates to reduce package warpage, and reduce oreliminate a need to use a thick heat spreader to reduce package warpage.A thinner heat spreader lid may be used, which may also help to reduce alevel of stress on solder bumps. Furthermore, standard package assemblylines may be used with little to no assembly line tooling modification.

CONCLUSION

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. It will be apparent to persons skilled in the relevant artthat various changes in form and detail can be made therein withoutdeparting from the spirit and scope of the embodiments. Thus, thebreadth and scope of the described embodiments should not be limited byany of the above-described exemplary embodiments, but should be definedonly in accordance with the following claims and their equivalents.

1. An integrated circuit (IC) package, comprising: a substrate havingopposing first and second surfaces; an IC die having opposing first andsecond surfaces, wherein the first surface of the die is flip chipmounted to the first surface of the substrate; a first thermal interfacematerial (TIM) on the second surface of the die in a first pattern, thefirst TIM having a first thermal resistance; a second TIM on the secondsurface of the die in a second pattern, the second TIM having a secondthermal resistance that is greater than the first thermal resistance;and a heat spreader lid having an open end mounted to the first surfaceof the substrate such that the die is positioned in an enclosure formedby the heat spreader lid and substrate, the first TIM and the second TIMeach being in contact with an inner surface of the heat spreader lid. 2.The IC package of claim 1, wherein the second TIM has a mechanicalrigidity that is greater than a mechanical rigidity of the first TIM. 3.The IC package of claim 2, wherein a first portion of the second TIM ison the second surface of the die in the first pattern and in contactwith the inner surface of the heat spreader lid, the IC package furthercomprising: a second portion of the second TIM that is positionedbetween and in contact with the first surface of the substrate and theinner surface of the heat spreader lid, and is separated from the die bya gap.
 4. The IC package of claim 2, further comprising: a stiffenerring mounted to the first surface of the substrate by the second TIM andattached to the inner surface of the heat spreader lid by the secondTIM, the stiffener ring forming a ring around the die.
 5. The IC packageof claim 1, wherein the first TIM is positioned on a central region ofthe second surface of the die, and the second TIM forms a ring-shapedpattern around the first TIM on the second surface of the die.
 6. The ICpackage of claim 1, wherein the first TIM forms a cross-shaped patternon a central region of the second surface of the die, and the second TIMis positioned on at least one corner region of the second surface of thedie.
 7. The IC package of claim 1, wherein the first TIM forms a firstrectangular shaped pattern across a central region of the second surfaceof the die, and the second TIM forms first second and third rectangularshaped patterns respectively across first and second opposite edgeregions on the second surface of the die.
 8. The IC package of claim 1,wherein the first TIM is positioned on the second surface of the die onat least one determined hot spot of the die.
 9. The IC package of claim1, further comprising: at least one additional TIM on the second surfaceof the die and in contact with the inner surface of the heat spreaderlid, the at least one additional TIM having a thermal resistance that isdifferent than the first thermal resistance and the second thermalresistance. 10-15. (canceled)
 16. A method for assembling an integratedcircuit package, comprising: mounting a first surface of an integratedcircuit die to a first surface of a substrate by a plurality ofelectrically conductive solder bumps; applying a first thermal interfacematerial (TIM) on a second surface of the die in a first pattern, thefirst TIM having a first thermal resistance; applying a second TIM to asurface, the second TIM having a second thermal resistance that isgreater than the first thermal resistance; mounting an open end of aheat spreader lid to the first surface of the substrate such that thedie is positioned in an enclosure formed by the heat spreader lid andsubstrate, the first TIM and the second TIM each being in contact withan inner surface of the heat spreader lid; and attaching a plurality ofinterconnect members to a second surface of the substrate.
 17. Themethod of claim 16, wherein said applying a second TIM to a surfacecomprises: applying the second TIM on the second surface of the die in asecond pattern.
 18. The method of claim 16, wherein said applying asecond TIM to a surface comprises: applying the second TIM to the firstsurface of the substrate to be separated from the die by a gap, thesecond TIM being connected between the first surface of the substrateand the inner surface of the heat spreader lid.
 19. The method of claim16, wherein said applying a second TIM to a surface comprises: mountinga first surface of a stiffener ring to the first surface of thesubstrate by the second TIM, the stiffener ring forming a ring aroundthe die; and applying the second TIM to the second surface of thestiffener ring to connect the second surface of the stiffener ring tothe inner surface of the heat spreader lid.
 20. An integrated circuitpackage assembled according to the method of claim
 16. 21. An integratedcircuit (IC) package, comprising: a substrate having opposing first andsecond surfaces; an IC die mounted to the first surface of thesubstrate; a first thermal interface material (TIM) on a surface of thedie, the first TIM having a first thermal resistance; a second TIM onthe surface of the die, the second TIM having a second thermalresistance that is greater than the first thermal resistance; and a heatspreader having a surface attached to the IC die by at least one of thefirst TIM or the second TIM, the first TIM and the second TIM each beingin contact with the surface of the heat spreader lid.
 22. The IC packageof claim 21, wherein the second TIM has a mechanical rigidity that isgreater than a mechanical rigidity of the first TIM.
 23. The IC packageof claim 22, wherein the second TIM is a solder and the first TIM is nota solder.
 24. The IC package of claim 21, wherein the second TIM isspatially separated from the first TIM on the surface of the die. 25.The IC package of claim 21, wherein the second TIM is in contact withthe first TIM on the surface of the die.
 26. The IC package of claim 21,wherein the first TIM is an adhesive gel and the second TIM is an epoxy.